Supplement TABLE S1, Supplement FIG S1, Supplement FIG S2, Supplement FIG S3, Supplement FIG S4, Supplement Moive S1.,,

TABLE S1. Parameters used in coupled numerical analysis. FIG. S1. The finite element model of the DMCs. FIG. S2. Correlation between the EWOD force and the dielectric layer permittivity. FIG. S3. Correlation between EWOD force and the dielectric layer thickness (frequency = 102 Hz). FIG. S4. Simulation result. Movie S1: Droplet and particle driving experiments in digital microfluidic chips.

附表S1：耦合数值分析所用参数
附图S1：数字微流控芯片（Digital Microfluidic Chips, DMCs）的有限元模型
附图S2：电润湿（Electrowetting on Dielectric, EWOD）力与介电层介电常数的相关性
附图S3：电润湿力与介电层厚度的相关性（驱动频率=102赫兹）
附图S4：仿真结果
视频S1：数字微流控芯片内的液滴与粒子驱动实验