CMOS Terahertz Plasmonic Interconnect towards Tera-scale Computing

This project seeks to solve several scientific and practical challenges that surface plasma presents for high-performance on-chip communication. With the knowledge gained, we aim to design a novel crosstalk-free all-surface-wave I/O transceiver using low-cost CMOS technologies instead of expensive processes, thereby allowing for real-life low-cost applications.

本项目旨在解决表面等离子体（Surface Plasma）在高性能片上通信领域所带来的多项科学与实际挑战。基于本项目所获得的研究认知，我们拟采用低成本互补金属氧化物半导体（CMOS）技术替代昂贵的制程工艺，设计一款新型无串扰全表面波I/O收发器，进而实现具备低成本优势的实际落地应用。