封装基板版图设计以及制备参数

本数据集是基于超导CPU和CMOS-SRAM等芯片组成的SC-MCM的基础上的基板设计和制备。方案采用基于较成熟的引线键合的SC-MCM封装结构对CPU、IF、AMP和SRAM四芯片进行联调封装。在封装基板设计之前，首先梳理清楚CPU、IF、AMP和SRAM四芯片之间的管脚定义以及互连关系，清楚供电电源的管脚和地以及信号管脚，根据要使用的测试杆确定好PCB的大小尺寸以及金手指的布局， 新建一个封装基板的工程文件，根据芯片的尺寸和管脚信息建立4个文件，元器件库、封装库、原理图和PCB文件。元器件库的文件在原理图进行组装和逻辑互连，封装库根据芯片的管脚和尺寸形成封装模型且与元器件库完成关联，原理图更新成PCB文件，对PCB完成设计后与芯片各方进行设计文件的确认，确认无误后对封装基板进行制备。数据内容涵盖封装基板项目文件、封装基板PCB文件、封装基板封装库文件、封装基板原理图文件、封装基板元器件库文件、封装基板通道使用说明、封装基板设计要点确认书、封装基板制备参数和封装基板联调测试说明等。数据量12.80MB。

This dataset involves the substrate design and fabrication of SC-MCM, which is constructed using chips such as superconducting CPU and CMOS-SRAM. The proposed solution adopts a relatively mature wire-bonding-based SC-MCM packaging structure to perform co-debugging and packaging for the four chips including CPU, IF, AMP and SRAM. Prior to packaging substrate design, the pin definitions and interconnection relationships among the four chips (CPU, IF, AMP and SRAM) shall first be clarified, along with the power supply pins, ground pins and signal pins. The PCB size and the layout of gold fingers shall be determined based on the intended test rod. Then, a new packaging substrate engineering project file is created, and four files are established according to the chip dimensions and pin information: component library, footprint library, schematic diagram and PCB file. The component library file is used for component assembly and logical interconnection in the schematic diagram. The footprint library is developed into packaging models based on the chip pins and dimensions, and associated with the component library. The schematic diagram is then updated to generate the PCB file. After completing the PCB design, the design files shall be confirmed with all relevant stakeholders of the chips. Upon successful confirmation, the packaging substrate will be fabricated. The dataset covers various documents including packaging substrate project files, packaging substrate PCB files, packaging substrate footprint library files, packaging substrate schematic files, packaging substrate component library files, packaging substrate channel usage instructions, packaging substrate design key points confirmation documents, packaging substrate fabrication parameters, and packaging substrate co-debugging test instructions. The total data volume is 12.80 MB.

搜集汇总

背景与挑战

背景概述

该数据集聚焦于微电子封装基板的版图设计与制备参数，基于超导CPU和CMOS-SRAM等芯片的SC-MCM结构，涵盖CPU、IF、AMP和SRAM四芯片的联调封装过程。数据内容包括项目文件、PCB设计、原理图、封装库等关键文件，以及制备参数和测试说明，总数据量约12.80MB，适用于芯片封装技术研究和工程应用。数据集由中国科学院上海微系统与信息技术研究所发布，属于'超导CPU研发'项目的一部分，具有较高的专业性和实用性。