微同轴芯片加工制备数据集
收藏国家基础学科公共科学数据中心2026-02-14 收录
下载链接：
https://nbsdc.cn/general/dataDetail?id=698df90c195d267dc0b43b8d&type=1
下载链接
链接失效反馈官方服务：
资源简介：
本次测试选择在河北北芯半导体科技有限公司国家半导体器件专利检验检查中心开展，根据《宽频带微型化双定向耦合器测试大纲》要求进行。本次测试采集于2025年7月2日开始，使用扫描电子显微镜进行微同轴加工层数、线宽精度、镀层厚度精度测试，满足指标要求，测试数据并包含加工层数、线宽精度和镀层厚度精度尺寸测试图片。
This test was conducted at the National Semiconductor Device Patent Inspection and Testing Center under Hebei Beixin Semiconductor Technology Co., Ltd., in accordance with the requirements of the *Test Outline for Broadband Miniaturized Dual Directional Couplers*. The test was launched on July 2, 2025. Scanning electron microscopy (SEM) was employed to test the processing layer count, line width accuracy, and coating thickness accuracy of the micro-coaxial structure, and all test results met the specified performance requirements. The collected test data also includes dimensional test images for the processing layer count, line width accuracy, and coating thickness accuracy.
提供机构：
西安交通大学
