Raw data of Fig. 4D from Copper/carbon nanotube composites: research trends and outlook

We present research progress made in developing copper/carbon nanotube composites (Cu/CNT) to fulfil a growing demand for lighter copper substitutes with superior electrical, thermal and mechanical performances. Lighter alternatives to heavy copper electrical and data wiring are needed in automobiles and aircrafts to enhance fuel efficiencies. In electronics, better interconnects and thermal management components than copper with higher current- and heat-stabilities are required to enable device miniaturization with increased functionality. Our literature survey encouragingly indicates that Cu/CNT performances (electrical, thermal and mechanical) reported so far rival that of Cu, proving the material's viability as a Cu alternative. We identify two grand challenges to be solved for Cu/CNT to replace copper in real-life applications. The first grand challenge is to fabricate Cu/CNT with overall performances exceeding that of copper. To address this challenge, we propose research directions to fabricate Cu/CNT closer to ideal composites theoretically predicted to surpass Cu performances (i.e. those containing uniformly distributed Cu and individually aligned CNTs with beneficial CNT–Cu interactions). The second grand challenge is to industrialize and transfer Cu/CNT from lab bench to real-life use. Toward this, we identify and propose strategies to address market-dependent issues for niche/mainstream applications. The current best Cu/CNT performances already qualify for application in niche electronic device markets as high-end interconnects. However, mainstream Cu/CNT application as copper replacements in conventional electronics and in electrical/data wires are long-term goals, needing inexpensive mass-production by methods aligned with existing industrial practices. Mainstream electronics require cheap CNT template-making and electrodeposition procedures, while data/electrical cables require manufacture protocols based on co-electrodeposition or melt-processing. We note (with examples) that initiatives devoted to Cu/CNT manufacturing for both types of mainstream applications are underway. With sustained research on Cu/CNT and accelerating its real-life application, we expect the successful evolution of highly functional, efficient, and sustainable next-generation electrical and electronics systems.

本研究阐述了铜/碳纳米管复合材料（copper/carbon nanotube composites，简称Cu/CNT）的研发进展，以满足日益增长的市场需求——当前亟需轻量化的铜基替代材料，且这类材料需具备更优异的电学、热学与力学性能。为提升燃油效率，汽车与航空领域亟需替代笨重铜质电力与数据布线的轻量化方案。在电子领域，为实现器件功能提升与微型化，亟需性能优于铜、具备更高电流与热稳定性的互连结构及热管理组件。本研究的文献综述结果令人振奋：目前已报道的Cu/CNT复合材料的电学、热学与力学性能已可与纯铜媲美，证明该材料作为铜替代材料具备可行性。本研究指出，若要使Cu/CNT在实际应用中替代纯铜，需攻克两大核心挑战。第一大挑战为制备综合性能优于纯铜的Cu/CNT复合材料。针对该挑战，本研究提出了研发方向：制备更接近理论预测的高性能理想复合材料——这类理想复合材料需满足铜基体均匀分散、碳纳米管（carbon nanotube，简称CNT）单独排列，且CNT与铜基体间存在有益相互作用。第二大挑战则是实现Cu/CNT复合材料的产业化，将其从实验室研发推向实际应用。为此，本研究针对利基与主流应用场景下的市场依赖型问题，提出了相应的解决策略。当前性能最优的Cu/CNT复合材料已可满足高端互连领域的利基电子设备市场应用需求。但将Cu/CNT作为铜替代材料应用于传统电子器件及电力/数据布线的主流场景，仍为长期目标，需依托契合现有工业体系的工艺实现低成本大规模生产。主流电子器件领域需采用低成本的CNT模板制备与电沉积工艺，而电力/数据电缆则需基于共电沉积或熔融加工的制造方案。本研究注意到，针对上述两类主流应用场景的Cu/CNT工业化研发项目已在推进（附相关实例）。随着Cu/CNT复合材料研究的持续推进与实际应用的加速落地，我们期待高性能、高效率且可持续的下一代电气与电子系统能够成功问世。