曲面多层电路增材制造材料性能检测数据集

曲面多层电路增材制造材料性能检测数据集主要面向适用于曲面多层电路增材制造的介电材料与导电材料物理性能和化学性能的研究，以及两者在成品样件的附着力研究，完成了材料筛选以及工艺参数优选，主要研究了纳米银电阻率、粘度，表面张力；碳浆粘度，固化温度；光敏树脂介电常数，介电损耗，粘度，表面张力，打印的介电层和导电层功能具备，性能验证通过。This material performance detection dataset for curved surface multi-layer circuit additive manufacturing is primarily designed for research on the physical and chemical properties of dielectric and conductive materials suitable for this manufacturing process, as well as the adhesion study of these two materials on finished specimens. Material screening and process parameter optimization have been completed. The key research contents include: resistivity, viscosity and surface tension of nano-silver; viscosity and curing temperature of carbon paste; dielectric constant, dielectric loss, viscosity and surface tension of photosensitive resin. The printed dielectric and conductive layers have their intended functions, and the performance verification has been successfully passed.

搜集汇总

背景与挑战

背景概述

该数据集聚焦于曲面多层电路增材制造过程中介电材料与导电材料的物理化学性能及附着力的检测，涵盖了纳米银、碳浆、光敏树脂等多种材料的电阻率、粘度、表面张力、固化温度及介电性能等关键参数，并基于测试结果完成了材料筛选与工艺参数优选，验证了打印的介电层和导电层功能的有效性。