自动化取放片系统开发与实验测试数据集

自动化取放片系统主要针对Micro-LED应用高自动化、高可靠性、产出外延片低颗粒度的需求开展开发与测试，根据MOCVD设备的整体需求，构建了一款适用于Micro-LED应用、6英寸与8英寸兼容、蓝宝石衬底与硅衬底兼容的自动化取放片系统，通过模组测试及系统集成测试结果显示该完全满足项目对自动化功能、低颗粒度的性能需求。该数据集主要采集了系统的架构方案、核心组件的选型、组件测试记录，系统的马拉松取放片测试记录等数据，数据量约为3.68MB。

The automated wafer handling system was developed and tested to meet the requirements of high automation, high reliability, and low particle generation for epitaxial wafers in Micro-LED applications. In line with the overall demands of MOCVD (Metal-organic Chemical Vapor Deposition) equipment, a dedicated automated wafer handling system tailored for Micro-LED applications was built, which supports both 6-inch and 8-inch wafers, as well as sapphire and silicon substrates. Modular and system integration test results show that this system fully satisfies the project's requirements for automated functions and low-particle performance. This dataset primarily collects data including the system's architectural scheme, core component selection, component test records, and the system's marathon wafer handling test records, with a total data volume of approximately 3.68 MB.