Dataset supporting the paper entitled “A High-Speed Design Methodology for Inductive Coupling Links in 3D-ICs”
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This dataset supports the article entitled 'A High-Speed Design Methodology for Inductive Coupling Links in 3D-ICs' accepted for publication in DATE 2018
本数据集为已被接收并将发表于2018年欧洲设计、自动化与测试会议(DATE 2018)的题为《面向三维集成电路(3D-ICs)电感耦合链路的高速设计方法》的论文提供支撑
创建时间:
2017-11-24



