蜂窝芯复合材料结构固化变形仿真数据集

复合材料芳纶蜂窝夹芯结构固化工艺仿真模型数据集主要面向基础研究、采用ANAQUS、COMSOL软件进行仿真建模分析研究蜂窝夹芯结构固化成型过程中模具温度场分布及结构件残余应力分布，阐明工艺热应力与蜂窝夹芯结构面板固化收缩对回弹变形的耦合作用机制，获得芳纶纸蜂窝夹芯结构外形回弹量，同时为工艺参数控制提供理论依据。主要记录了模型图、有限元结果云图、绘图数据、实验照片等。数据量2.75GB。

Dataset of Curing Process Simulation Models for Composite Aramid Honeycomb Sandwich Structures
This dataset is primarily targeted for fundamental research. It utilizes ANAQUS and COMSOL software to perform simulation modeling and analysis on the distribution of mold temperature field and residual stress in structural components during the curing and forming process of honeycomb sandwich structures, aiming to clarify the coupling mechanism between process thermal stress and curing shrinkage of honeycomb sandwich structure panels, and their combined effect on springback deformation, as well as obtain the springback magnitude of aramid paper honeycomb sandwich structures. Meanwhile, it provides a theoretical basis for process parameter control. The dataset mainly records model diagrams, finite element result cloud maps, plotting data, experimental photos, and other related materials, with a total data volume of 2.75 GB.

搜集汇总

背景与挑战

背景概述

该数据集是蜂窝芯复合材料结构固化变形仿真数据集，专注于芳纶蜂窝夹芯结构固化工艺的仿真建模，使用ABAQUS和COMSOL软件分析温度场和残余应力分布，以研究回弹变形机制。数据集包含模型图、有限元结果云图等文件，总数据量约2.75GB，源自同济大学承担的国家重点研发计划项目，旨在为工艺参数控制提供理论依据。