LCoS芯片像素数据

面向5G超宽带骨干网动态可重构网络应用场景，研制LCoS芯片需要验证芯片像素性能。数据采集方式为：在温度(23+3)℃，湿度(55±5)RH的洁净实验室环境下，使用电子扫描显微镜（SEM）对LCoS芯片进行成像，获取单个像素尺寸及像素间隔的高分辨率图像数据；采用白光轮廓仪对芯片进行轮廓扫描，测量包含10个像素周期的尺寸信息，并记录芯片有效像素区域四个角点在平移台坐标系下的位置。该数据集为芯片占空比及分辨率的精确计算提供了关键支撑数据。数据保存格式为.tif和.png图像文件，数据大小32.1MB。时间及地点：2025年5月，中国科学院上海高等研究院。

Targeting the dynamically reconfigurable network application scenarios of 5G ultra-broadband backbone networks, it is necessary to verify the pixel performance of LCoS chips during their development. The data collection was carried out in a clean laboratory environment with a temperature of (23±3)°C and humidity of (55±5) %RH. A scanning electron microscope (SEM) was used to image the LCoS chips, obtaining high-resolution image data of individual pixel dimensions and pixel spacing; a white light profilometer was employed to perform contour scanning on the chips, measuring dimensional information covering 10 pixel cycles, and recording the positions of the four corner points of the chip's effective pixel region in the translation stage coordinate system. This dataset provides critical supporting data for the accurate calculation of chip duty cycle and resolution. The data is saved in .tif and .png image file formats, with a total size of 32.1 MB. Data collection was conducted in May 2025 at the Shanghai Advanced Research Institute, Chinese Academy of Sciences.