Analysis of Ball Soldering Parameters on the Properties of a BGA Packaged Semiconductor

Integrated circuits have several applications, including medicine and the aerospace industry, where reliability is essential. Packaging is an important step in the manufacturing of integrated circuits, and ball soldering is one of the most critical process, especially in assembling and interconnecting integrated circuits. The solder joint formed during the ball soldering process is intrinsically associated with the performance and the reliability of the electronic system. This study analyzed the influence of parameters or factors affecting the ball soldering process from the perspective of intermetallic compound formation and shear stress of the solder joint. The results indicate there is an interaction coupling between these two factors that cannot be seen when they are investigated individually, meaning that the individual effect of each factor differs from that of the combinations of factors. The results showed that the factor that most influenced shear stress and thickness of the intermetallic compound was peak temperature during ball soldering.

集成电路拥有诸多应用场景，涵盖医药与航空航天工业领域——此类场景对可靠性有着极高要求。封装是集成电路制造流程中的关键环节，而球焊（ball soldering）则是其中最核心的工艺之一，尤其在集成电路的组装与互连环节中尤为重要。球焊工艺所形成的焊点，与电子系统的性能及可靠性有着本质关联。本研究从金属间化合物（intermetallic compound）生成与焊点剪切应力的角度，分析了影响球焊工艺的各类参数与因素。研究结果表明，两类因素间存在耦合交互效应——当单独研究各因素时，该效应无法被观测到；这意味着单个因素的影响效果，与其组合使用时的效果存在显著差异。研究结果显示，对剪切应力与金属间化合物厚度影响最大的因素，为球焊过程中的峰值温度。