Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth

Name: Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth
Creator: Chen, Po-Yu; Lee, Yun-Fong; Huang, Yu-Chen; Cheng, Ting-Yi; Chang, Po-Kai; Liu, Cheng-Yi; Chang, Jui-Sheng; Lo, Mei-Hsin; Huang, Wei-Chieh; Fu, Kuan-Lin; Lai, Tse-Lin; Yu, Zhong-Yen
Published: 2024-09-10 00:00:00
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The Royal Society Figshare2024-09-10 更新2026-04-17 收录

下载链接：

https://rs.figshare.com/articles/dataset/Supplementary_Material_from_Low_temperature_Cu-Cu_direct_bonding_in_air_ambient_by_ultrafast_surface_grain_growth/26956246/1

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资源简介：

electronic supplementary material (ESM)-dataset.xlsx

提供机构：

Chen, Po-Yu; Lee, Yun-Fong; Huang, Yu-Chen; Cheng, Ting-Yi; Chang, Po-Kai; Liu, Cheng-Yi; Chang, Jui-Sheng; Lo, Mei-Hsin; Huang, Wei-Chieh; Fu, Kuan-Lin; Lai, Tse-Lin; Yu, Zhong-Yen

创建时间：

2024-09-06