Dataset to the publication Fracture behaviour of functionally graded bi-material interface produced by wire arc additive manufacturing

Dataset to Fracture behaviour of functionally graded bi-material interface produced by wire arc additive manufacturing, including FEM Analysis files, EBSD, Fracture Toughness, and Tensile Testing source data files. The data was obtained to describe the underlying deformation mechanisms at play during the mechanical deformation of a diluted interface layer. This diluted interface layer is formed between low alloy and stainless steels after cladding one onto the other after multi-material additive manufacturing. The data is the one measured through metallurgical and mechanical characterization procedures. Data set includes the output of several techniques, including: ABAQUS CAE - FEM data files with geometrical, boundary condition, mesh and load data, as well as summarized results for bi-material SENB specimensElectron Backscatter Diffraction (EBSD) - crystallographic information files, including files and graphs shown in the related publicationFractureToughness - pre-cracking, load-CMOD and derived plots for the fracture toughness analysis of conventional and bi-material SENB specimens,and TensileTesting - load-displacement values, as well as work-hardening values for data obtained under quasi-static tensile testing of bi-material and conventional specimens.

本数据集针对电弧增材制造制备的功能梯度双材料界面的断裂行为研究，涵盖有限元分析（FEM）文件、电子背散射衍射（EBSD）数据、断裂韧性数据及拉伸测试原始数据文件。本数据集旨在阐明稀释界面层在机械变形过程中的潜在作用机制与变形行为，该稀释界面层是在多材料增材制造过程中，通过在低合金钢表面熔覆不锈钢后形成的界面过渡层。本数据集通过冶金与力学表征流程测得，包含多种测试技术的产出成果，具体包括：ABAQUS CAE有限元数据文件，涵盖几何参数、边界条件、网格划分方案与载荷数据，以及双材料单边切口梁（SENB）试样的汇总分析结果；电子背散射衍射（EBSD）晶体学信息文件，包含相关已发表学术论文中呈现的文件与图表；断裂韧性分析数据，涵盖常规及双材料单边切口梁试样断裂韧性分析所需的预制裂纹、载荷-裂纹嘴张开位移（CMOD）曲线及衍生图表；拉伸测试数据，包含双材料及常规试样在准静态拉伸测试下获取的载荷-位移值与加工硬化值。