Total grain numbers and nucleation ratios during numerical simulation Sn grain growth in composite solder joint

Name: Total grain numbers and nucleation ratios during numerical simulation Sn grain growth in composite solder joint
Creator: RepOD
Published: 2026-06-18T09:38:54+08:00

RepOD Repository for Open Data2026-06-18 更新2026-07-23 收录

焊点微观结构模拟

晶粒成核行为

数据链接：

https://repod.icm.edu.pl/dataset.xhtml?persistentId=doi:10.18150/CQNXR5 数据链接链接失效反馈

官方服务：

资源简介：

Illés, Balázs; István, Bozsóki; Attila, Géczy, 2026, "Total grain numbers and nucleation ratios during numerical simulation Sn grain growth in composite solder joint", https://doi.org/10.18150/CQNXR5, RepOD, V1

提供机构：

RepOD

创建时间：

2026-06-18

Total grain numbers and nucleation ratios during numerical simulation Sn grain growth in composite solder joint

资源简介：

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