流变多级阶进式抛光分级策略和理想抛光条件数据集
收藏资源简介：
本数据集面向超精密光学制造与硬脆材料加工领域的核心需求，聚焦熔石英材料在动态流变场中的可加工性优化及裂纹扩展抑制机制研究，旨在通过多尺度实验与多物理场仿真相结合的方法，揭示流变抛光工艺中材料去除与亚表面损伤的关联规律。通过纳米压痕仪对熔石英晶片进行变载单/双划痕实验，结合临界力测试与间距梯度设计，实时采集载荷-位移曲线及划痕深度数据；利用扫描电镜观测表面裂纹扩展、切屑分布及剥落形貌，并通过聚焦离子束制备亚表面样品，采用透射电镜解析纳米级晶格损伤与裂纹三维扩展路径。数值模拟方面，基于LAMMPS分子动力学软件构建非晶熔石英模型，开展双划痕相互作用仿真，导出原子位移场、应力分布及亚表面损伤演化数据，结合Ovito后处理实现多尺度损伤可视化抛光工艺验证环节，采用激光干涉仪与光学轮廓仪高精度测量抛光前后表面形貌，结合流变仪对光流变液的黏弹性特性进行系统表征，形成从纳米划痕机理到宏观抛光效果的全链条数据体系。数据集包含八大模块：（1）熔石英变载双划痕力学响应数据；（2）SEM/TEM跨尺度表面-亚表面损伤形貌库；（3）分子动力学仿真原子级损伤演化数据；（4）动态流变场CFD模拟结果；（5）光流变液流变特性参数；（6）抛光前后表面粗糙度对比数据；（7）工艺参数优化对照表；（8）多级阶进式抛光策略验证数据。本数据集首次实现熔石英材料在流变抛光中“纳米损伤机制-介观裂纹扩展-宏观去除效率”的多尺度关联分析，突破传统抛光工艺经验依赖的局限性，为动态流变场调控、亚表面损伤抑制及分级抛光策略制定提供理论依据与数据支撑，适用于光学元件制造、半导体材料加工及超精密表面工程领域的学术研究与工业应用，具有显著的技术创新价值与产业化推广潜力。
This dataset targets the core demands of ultra-precision optical manufacturing and hard and brittle material processing fields, focusing on the research of machinability optimization and crack propagation suppression mechanism of fused silica in dynamic rheological field. It aims to reveal the correlation law between material removal and subsurface damage in rheological polishing processes by combining multi-scale experiments and multi-physics simulation methods. Variable-load single/double scratch tests are conducted on fused silica wafers using a nanoindentation tester, combined with critical force testing and spacing gradient design, to collect load-displacement curves and scratch depth data in real time. Surface crack propagation, chip distribution and spalling morphology are observed via a scanning electron microscope (SEM). Subsurface samples are prepared by focused ion beam (FIB), and nanoscale lattice damage and 3D crack propagation paths are analyzed using a transmission electron microscope (TEM). For numerical simulation, an amorphous fused silica model is built based on the LAMMPS molecular dynamics software, and double scratch interaction simulations are carried out. Atomic displacement fields, stress distribution and subsurface damage evolution data are exported, and multi-scale damage visualization is realized combined with Ovito post-processing. In the polishing process verification link, laser interferometer and optical profiler are used to accurately measure the surface topography before and after polishing, and the viscoelastic properties of the photorheological fluid are systematically characterized by a rheometer, forming a full-chain data system from nanoscratch mechanism to macroscale polishing effect. This dataset includes eight modules: (1) Mechanical response data of variable-load double scratches on fused silica; (2) Cross-scale surface-subsurface damage morphology library based on SEM/TEM; (3) Atomic-scale damage evolution data from molecular dynamics simulations; (4) Computational Fluid Dynamics (CFD) simulation results of dynamic rheological field; (5) Rheological property parameters of photorheological fluid; (6) Surface roughness comparison data before and after polishing; (7) Process parameter optimization comparison table; (8) Verification data of multi-stage stepped polishing strategy. This dataset is the first to conduct multi-scale correlation analysis of "nanoscale damage mechanism - mesoscale crack propagation - macroscale material removal efficiency" for fused silica during rheological polishing, breaking the limitation of empirical dependence in traditional polishing processes. It provides theoretical basis and data support for dynamic rheological field regulation, subsurface damage suppression and formulation of graded polishing strategies, and is suitable for academic research and industrial applications in the fields of optical component manufacturing, semiconductor material processing and ultra-precision surface engineering, with significant technological innovation value and industrialization promotion potential.
