Literature Study on Thermal Interface Materials

This set provides supplementary data for the following paper:
This dataset contains calculated thermal resistance values (R_th) for various Thermal Interface Materials (TIMs) used in graphics card assemblies. Calculations are based on realistic geometries, power consumption values, and thermal conductivities typical for high-performance GPUs. The effects of a proposed metallurgical bonding layer formed via Al-Cu compound casting are also evaluated. Performance comparisons are made for different TIM configurations (thermal pastes, pads, solder, compound joints) across high-end and mid-range GPU models (e.g., NVIDIA RTX 4090 and 4070). Temperature reductions are quantified as a function of interface quality and thermal power dissipation.