基于融合芯片的串扰抵消技术的仿真数据集
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基于中国科学院微电子研究所2025年1月采集的仿真与实验观测数据，面向大规模多输入多输出（MIMO）通信系统与集成电路设计研究领域，围绕“可重构射频前端设计中的串扰抑制与多通道隔离度优化”核心科学问题开展系统性数据采集与整理。数据集主要记录了2x2/4x4 MIMO模型的S31端口隔离度参数（表征信号耦合效应）、近场耦合强度分布、CMOS工艺衬底传输线特性等关键值，数据量总计31MB。该数据集基于22nm CMOS工艺，通过ADS软件构建MIMO传输线模型，系统整合了设计框图、仿真结果（含隔离度曲线）、第三方测试图表、测试报告、科技文档及论文、专利。其内容聚焦验证可重构射频前端的三项核心技术指标：MIMO模型仿真精度、串扰参数量化分析及隔离度优化效果，为5G/6G通信系统的高密度集成射频芯片设计、多通道信号完整性提升提供理论与实验支撑，兼具学术研究与工程应用价值。
Based on the simulation and experimental observation data collected by the Institute of Microelectronics of the Chinese Academy of Sciences in January 2025, this dataset targets the research fields of massive multiple-input multiple-output (MIMO) communication systems and integrated circuit design, with systematic data collection and organization carried out around the core scientific issue of "crosstalk suppression and multi-channel isolation optimization in reconfigurable radio frequency front-end design". The dataset mainly records key parameters including the S31 port isolation parameters of 2x2/4x4 MIMO models (which characterize signal coupling effects), near-field coupling strength distribution, and CMOS process substrate transmission line characteristics, with a total data volume of 31 MB. Based on the 22nm CMOS process, MIMO transmission line models were constructed via ADS software for this dataset, which systematically integrates design block diagrams, simulation results (including isolation curves), third-party test charts, test reports, scientific and technical documents, papers, and patents. Its content focuses on verifying three core technical indicators of reconfigurable radio frequency front-ends: MIMO model simulation accuracy, quantitative analysis of crosstalk parameters, and isolation optimization effects, providing theoretical and experimental support for high-density integrated RF chip design and multi-channel signal integrity improvement of 5G/6G communication systems, with both academic research and engineering application values.
