Design and Finite Element Analysis of Prefabricated Waffle Slabs for Electronic Chip Manufacturing Plants

Based on an electronic chip factory project in Shanghai， an integrated prefabricated waffle slab system has been proposed. Using finite element modeling， the effects of joint depth and live load mass on the natural frequency， stiffness， and in-situ frequency response function of the floor slab were analyzed. The results showed that as the joint depth in the waffle slab increased， the natural frequency of the same order and the stiffness of the waffle slab decreased， while the vibration response of the floor increased. Moreover， the greater the joint depth， the more rapidly these indicators changed. When the joint depth was within 100 mm， the variations in the stiffness and peak frequency response function of the waffle slab remained within 5%， indicating the feasibility of the prefabricated concrete waffle slab system. The live load mass contributed to controlling the speed and acceleration responses of the floor but did not affect its dynamic stiffness. The formula derived from a single-degree-of-freedom system can accurately estimate the displacement， velocity， and acceleration frequency response functions of the floor structure under live loads and is recommended for practical engineering applications.