Investigation of pulsed X-rays ability to trigger Single Event Effects in Integrated components: correlation to standard test methods, sensi

This experiment investigates the capability of pulsed X-rays to trigger Single Event Effects (SEE) in integrated electronic components. The objectives are to correlate the SEE response under pulsed X-rays with standard heavy-ion and proton test methods, map sensitive volumes, and assess the influence of beam characteristics such as pulse dose and width.
Samples include electronic boards with test chips, FPGA boards, and power devices using Si, SiC, and GaN technologies. We will use two latch-up testers (GeV and TILU 2) to detect and analyze latch-up events in real-time.
The results will help determine the relevance of pulsed X-rays for SEE studies and provide insights into failure mechanisms across different semiconductor technologies.