Semiconductor foundries revenue share worldwide 2019-2024, by quarter

In the first quarter of 2024, Taiwan Semiconductor Manufacturing Company (TSMC) recorded a market share of 61.7 percent in the global semiconductor foundry market, while Samsung occupied 11 percent of the market. In terms of revenue, the top ten semiconductor foundries worldwide generated 29.2 billion U.S. dollars in the first quarter of 2024. Semiconductor manufacturing processThe semiconductor supply chain can be categorized into roughly three distinct stages: design, fabrication, and assembly. Companies that perform all three of these steps are referred to as integrated device manufacturers, with examples including Intel and Samsung. Firms that only design chips, known as fabless IC companies, rely on chip manufacturers, or foundries, for fabrication. Semiconductor foundriesFabless companies work closely with the foundries – companies that manufacture chips in fabrication plants (fabs) – with the market leader TSMC contracted by a variety of companies. Founded in 1987, TSMC decided not to manufacture any products under its name so that the company never engages in direct competition with its customers. Under this strategy, TSMC became the world’s largest semiconductor foundry and a key supplier for large tech companies.

在2024年的第一季度，台湾积体电路制造股份有限公司（TSMC）在全球半导体代工市场中占据了61.7%的市场份额，而三星则占据了11%的市场份额。就收入而言，全球前十大半导体代工厂在2024年第一季度共创造了292亿美元的收益。半导体制造工艺半导体供应链可以大致分为三个相互独立的阶段：设计、制造和组装。执行这三个步骤的公司被称为集成电路制造企业，例如英特尔和三星。仅负责芯片设计的无晶圆厂集成电路公司（fabless IC companies）则依赖于芯片制造商，即代工厂，进行制造。半导体代工厂无晶圆厂公司与代工厂紧密合作——这些代工厂在制造工厂（fabs）中生产芯片——市场领导者TSMC与众多公司签订合同。成立于1987年的TSMC决定不使用其品牌名称制造任何产品，从而确保公司从不与其客户直接竞争。遵循这一战略，TSMC成为了全球最大的半导体代工厂，并成为大型科技公司的重要供应商。