"IEEE Electronics Packaging Society TC-EDMS Benchmark: Problem 5 - PI Via"

"The Packaging Benchmark Suite by IEEE Electronics Packaging Society (EPS) Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS) aims to provide information about electromagnetic, electrical and circuit modeling and simulation problems encountered and the computational methods used when designing, analyzing, and developing electronic packages.This is Benchmark Problem #5 in the suite.The problem is an experiment on a panel of via field coupling and crosstalk structures for ultra-low impedance power integrity (PI) measurements and simulations. The focus is on measurement and simulation of a simple 4 via subset of a via array that is shorted to a single ground plane. This simple geometry represents the impedance requirement of a high-current power distribution network with running DC source. It is a common geometry found in many systems that require same-side probing and the complexity of precision characterization and modeling is often not considered by those characterizing and using these structures. While simulation, measurement and correlation of PI impedance values in the milliohm range or higher have been practiced with reasonable accuracy for some time, correlation of orders of magnitudes lower impedances is harder. The lack of a readily available reference platform, confidentiality concerns about Intellectual Property (IP) included in the Device Under Test (DUT) or details of the measurement instrumentation or details of simulation software hinder the dialog among the parties involved. The goal of this benchmark problem is to offer a simple and easy-to-reproduce reference platform that anyone can make, measure and simulate.  The problem includes simulation and measurement results from the author as well as measurement data from two additional laboratories.  "