8英寸惯性传感器成套工艺关键步骤工艺参数数据集
收藏资源简介：
本数据集采集了8英寸MEMS惯性传感器成套工艺关键步骤的工艺参数，涵盖键合层数、功能层厚度、最小线宽及深宽比等核心指标，数据采集时间为2021年至2024年。测试过程严格依据标准化流程，在上海新微技术研发中心有限公司八寸线洁净室内完成，采用白光干涉膜厚测量仪、扫描电子显微镜（SEM）等专业设备，结合晶圆级多点测量与截面制样分析方法，获取高精度数据。实验结果表明，键合层数大于2层，功能层厚度均值为30.12μm，最小线宽达1.99μm，深宽比优化至27.7:1。通过晶圆键合、深硅刻蚀等工艺的量化表征，数据集揭示了关键结构参数对惯性传感器灵敏度与稳定性的影响规律，为MEMS惯性器件的多轴集成设计、工艺兼容性优化及量产一致性控制提供了可靠的数据支撑，对推动高精度惯性导航技术在自动驾驶、消费电子等领域的应用具有重要意义。
This dataset collects process parameters of key steps in the complete manufacturing process of 8-inch MEMS inertial sensors, covering core indicators such as the number of bonding layers, functional layer thickness, minimum line width, and aspect ratio. The data was collected from 2021 to 2024. The testing was conducted strictly in accordance with standardized procedures in the cleanroom of the 8-inch wafer line of Shanghai Xinwei Technology R&D Center Co., Ltd. High-precision data was obtained using professional equipment such as white-light interferometric film thickness measuring instruments and scanning electron microscopy (SEM), combined with wafer-level multi-point measurement and cross-section sample preparation analysis methods. The experimental results show that when the number of bonding layers exceeds 2, the average functional layer thickness is 30.12 μm, the minimum line width reaches 1.99 μm, and the aspect ratio is optimized to 27.7:1. Through quantitative characterization of processes such as wafer bonding and deep silicon etching, this dataset reveals the influence laws of key structural parameters on the sensitivity and stability of inertial sensors, providing reliable data support for multi-axis integrated design, process compatibility optimization, and mass production consistency control of MEMS inertial devices. It is of great significance for promoting the application of high-precision inertial navigation technology in fields such as autonomous driving and consumer electronics.
