回流先进半导体封装：创新、供应链安全和美国半导体领先地位

IntheUnitedStates,boththesemiconductorindustryandthegovernmentareengagedinambitiousplanstoexpanddomesticsemiconductormanufacturingcapacity.PreviousCSETresearchhascoveredindetailtheseeffortsto“re-shore”thismanufacturing.https://cset.georgetown.edu/publication/reshoring-chipmaking-capacity-requires-high-skilled-foreign-talent/;WillHunt,“SustainingU.S.CompetitivenessinSemiconductorManufacturing”(CSET,January2022),https://cset.georgetown.edu/publication/sustaining-u-s-competitiveness-in-semiconductor-manufacturing/;JohnVerWey,“NoPermits,NoFabs:TheImportanceofRegulatoryReformforSemiconductorManufacturing”(CSET,October2021),https://cset.georgetown.edu/publication/no-permits-no-fabs/."style="transition-duration:0.4s;transition-property:background-color,border-color,box-shadow,color,opacity,text-shadow,transform,-webkit-box-shadow,-webkit-transform;transition-timing-function:ease-in-out;box-sizing:inherit;background-color:transparent;color:rgb(93,96,96);outline-offset:0.111111em;">1TheresearchfoundthattheCreatingHelpfulIncentivestoProduceSemiconductors(CHIPS)forAmericaActincentives,ifcarefullytargetedandaugmentedbyadequateregulatoryandworkforcesupport,couldreversetheobservabledeclineinU.S.semiconductormanufacturingcapacitysince1990.ThispaperexpandsonthatworkandarguesthattargetedinvestmentincentivestoincreaseU.S.-basedadvancedpackagingcapacityarealsoimportant.Historically,packagingwasviewedasalabor-intensiveandlowvalue-added“back-end”activity(asopposedtohighvalue-added“front-end”semiconductorfabrication).Asaresult,firmsoffshoredtheseactivitiestooverseaslocations,primarilyinAsia.Twomacrotrendsaredrivingachangeinhowpackagingisviewed:First,firmsincreasinglyrecognizehowimportantpackagingistoprocessingpower,particularlyasMoore’sLawslows.Asaresult,firmsareinvestinglargeamountsofcapitaltodevelopequipment,materials,andsystemsthatsupporttheadvancedpackagingecosystem.Second,innovationinadvancedpackagingwillbeakeydeterminantofthedepthandbreadthofinnovationinotheremergingtechnologies.Thispaper’skeyfindingsandrecommendationsinclude:Leadershipinadvancedpackagingisessentialforfuturesemiconductorindustrycompetitiveness.AsthelimitsofMoore’sLawarereached,advancesinpackagingareincreasinglyessentialtomaintaininnovationroadmapsandimprovesystemperformance.ThereislimitedsemiconductorpackagingcapacityintheUnitedStates,andtheassociatedecosystemislacking.Theglobalsemiconductorindustryhascontinuedamulti-decadetrendoflocatingmostassembly,test,andpackagingfacilitiesinAsia.Likewise,thepackagingecosystemisconcentratedinAsia.TheresultoftheseinvestmentsisadearthofpackagingcapacityintheUnitedStates,andthetrendextendstoadvancedpackaging.Re-shoringadvancedpackagingisessentialtoincreasesemiconductorsupplychainsecurity.IncreasingU.S.semiconductorsupplychainresilienceisaneconomicandnationalsecuritypriority.TheUnitedStatesneedstoincreasedomesticcapacityinbothsemiconductormanufacturingandadvancedpackaging.MultipleprovisionswithintheCHIPSActauthorize,butdonotrequire,fundstobedirectedtowardadvancedpackagingprojects.Fundsshouldbetargetedtoincentivizethesestepsandtheresilienceoftheassociatedecosystem(forexample,substrates).ThecurrentfocusonincreasingthecapacityforadvancedsemiconductorfabricationshouldbepairedwithaconcurrentemphasisonU.S.-basedadvancedpackaging.TheCHIPSActrightlyfocusesonincreasingdomesticsemiconductorfabrication.TheUnitedStatesshouldalsousefundsmadeavailablebythislegislationtoincreasetheadvancedpackagingthatintegrateddevicemanufacturers(IDMs)andfoundriesprovide.Thiscanbeaccomplishedbyfavoringfabricationprojectproposalsthatincludeco-locatedpackagingfacilities.TheUnitedStatesshouldcreateandimplementprogramstoincreasedomesticadvancedpackaginginnovation.Improvementsinadvancedpackagingwillpartiallydictatefuturesemiconductorindustryleadership.Innovationswilloccurinareassuchaschiplets,wafer-levelpackaging,andpackagingequipmentautomation.TheUnitedStatescanandshouldmakeinvestmentsandprovideincentivestoensurecontinuedsemiconductorindustryleadershipintheseareas.