晶圆3D封装技术专利数据

晶圆3D封装技术专利数据，包括国内外晶圆3D封装技术相关发明专利数据，通过从专利文件、法律信息、运营情况等维度对专利质量进行评估，从而筛选出本领域的重点专利，有助于企业掌握晶圆3D封装技术的发展趋势，梳理出存在潜在竞合关系的行业龙头企业。数据采集：通过对晶圆3D封装技术进行技术拆解，根据各技术分支的关键词和分类号在第三方检索平台上检索出各技术分支的专利数据，再将各技术分支专利数据汇总并去噪。 数据处理：对专利的多个维度进行评价打分，通过算法计算出专利基础分和附加分，专利评分总分100分，等于基础分和附加分之和，总分越高则专利质量越好，反之亦然。基础分等于各基础维度评分加权后求和，基础维度及权值为：引用专利数量10%、被引用专利数量10%、IPC分类数量10%、文献页数30%、权利要求数40%，基础维度的权重值赋值方法为：①多名专家依据经验对各维度主观赋值，②统计专家的主观赋值，去最大值与最小值后求平均值，③评分维度n的权重值=评分维度n的平均赋值/∑各评分维度的平均赋值*100%，计算结果按四舍六入五成双规则精确到10% 。附加分=（100-基础分）/100*加权附加评分，附加维度及权值为：简单同族成员数量20%、专利权是否转移20%、许可次数20%、质押次数10%、无效次数30%，附加维度的权重赋值方法和基础维度的权重赋值方法相同；各附加维度评分加权后求和即为加权附加评分，加权附加评分最高为100分。

Patent data for wafer 3D packaging technology, including invention patent data related to wafer 3D packaging technology both domestically and internationally. This dataset evaluates patent quality from dimensions including patent documents, legal information, and operational status to screen out key patents in this field, helping enterprises grasp the development trends of wafer 3D packaging technology and identify leading enterprises in the industry with potential competitive-cooperative relationships.

Data Collection: First, perform technical disassembly of wafer 3D packaging technology, retrieve patent data for each technical branch via third-party patent retrieval platforms using their corresponding keywords and classification numbers, then aggregate and denoise the collected patent data across all technical branches.

Data Processing: Patents are scored and evaluated across multiple dimensions, with the basic score and additional score calculated via algorithms. The total patent score is 100 points, which equals the sum of the basic score and additional score. The higher the total score, the better the patent quality, and vice versa.

The basic score is the weighted sum of scores from each basic dimension. The basic dimensions and their weights are: number of outgoing citations (10%), number of incoming citations (10%), number of IPC classifications (10%), number of document pages (30%), and number of claims (40%). The weight assignment method for basic dimensions is as follows: ① Multiple experts subjectively assign weights to each dimension based on experience; ② Collect the subjective assignment results from all experts, remove the maximum and minimum values, then calculate the average value; ③ The weight of dimension n = (average assignment value of dimension n / sum of average assignment values of all dimensions) × 100%. The calculation result is rounded to 10% following the round half to even rule.

The additional score = (100 - basic score) / 100 × weighted additional score. The additional dimensions and their weights are: number of simple patent family members (20%), whether the patent right has been transferred (20%), number of licensing instances (20%), number of pledge instances (10%), and number of invalidation instances (30%). The weight assignment method for additional dimensions is identical to that for basic dimensions. The weighted additional score is the weighted sum of scores from each additional dimension, with a maximum value of 100 points.

搜集汇总

数据集介绍

特点

该数据集包含951条晶圆3D封装技术相关发明专利数据，涵盖国内外信息，每年更新。通过多维度评估专利质量，帮助企业掌握技术发展趋势和识别行业龙头企业。