PLC CWDM Wafer Fabrication Measurements

This dataset contains fabrication measurements from 2,790 wafers used to create coarse wavelength-division multiplexing (CWDM) planar lightwave circuit (PLC) devices. Each record corresponds to a specific wafer, fabrication operation, and parameter, with measurements captured across five spatial wafer regions: left, top, center, bottom, and right. The data includes operation metadata (e.g., layer, ID, name), parameter categories (e.g., ETCH_DEPTH, LAYER_THICKNESS), and temporal alignment using date_idx, min_date_idx, and max_date_idx. It supports research in spatiotemporal modeling, yield analysis, and fabrication excursion detection.