Csp3–Csp3 Bond-Forming Reductive Elimination from Well-Defined Copper(III) Complexes
收藏Figshare2019-02-06 更新2026-04-29 收录
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https://figshare.com/articles/dataset/Csp_sup_3_sup_Csp_sup_3_sup_Bond-Forming_Reductive_Elimination_from_Well-Defined_Copper_III_Complexes/7683608
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Carbon–carbon bond-forming reductive elimination from elusive organocopper(III) complexes has been considered the key step in many copper-catalyzed and organocuprate reactions. However, organocopper(III) complexes with well-defined structures that can undergo reductive elimination are extremely rare, especially for the formation of Csp3–Csp3 bonds. We report herein a general method for the synthesis of a series of [alkyl-CuIII-(CF3)3]− complexes, the structures of which have been unequivocally characterized by NMR spectroscopy, mass spectrometry, and X-ray crystal diffraction. At elevated temperature, these complexes undergo reductive elimination following first-order kinetics, forming alkyl-CF3 products with good yields (up to 91%). Both kinetic studies and DFT calculations indicate that the reductive elimination to form Csp3–CF3 bonds proceeds through a concerted transition state, with a ΔH⧧ = 20 kcal/mol barrier.
创建时间:
2019-02-06



