MADIA_732678_SCRIBA_Bonding images and protocol_01
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https://zenodo.org/record/2609005
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Collection of protocol and images on bonding procedure of:
PDMS on several substrates (glass, silicon wafer, SU-8);
a polystyrene transparent top layer on sensors substrate.
Data produced between from April 2017 to November 2017.
创建时间：
2020-01-24
