Constructing a 3D Chemomechanical Au-PI Interface via Stabilizing Pyrolytic Intermediates to Overcome the Adhesion-Conductivity Trade-Off for Stable Gold Coatings

Dataset title: Raw data for "Constructing a 3D Chemomechanical Au-PI Interface via Stabilizing Pyrolytic Intermediates to Overcome the Adhesion-Conductivity Trade-Off for Stable Gold Coatings" Research Hypothesis: The classical trade-off between adhesion and conductivity in gold metallization on polyimide (PI) can be overcome by utilizing sulfur-containing decomposition products generated during gold thiolate pyrolysis. These transient intermediates are selectively captured and stabilized at the Au–PI interface through synergistic interaction between the PI surface and the forming gold, constructing a 3D chemomechanical interlocking architecture that simultaneously provides strong adhesion and high conductivity. Key Findings: Sheet resistance drops from ~2.68 Ω/sq (Ink-A) to ~0.28 Ω/sq (Ink-B25) upon resin addition All coatings achieve 5B adhesion grade (ASTM D3359) Gold network forms at 300 °C; organic residues fill pores at 350 °C XPS confirms Au–S bonding (161.38 eV, ~62%) and sulfate species (169.11 eV, ~38%) Bending tests: stable up to 20,000 cycles at R = 2–3 mm; R/R₀ ≈ 3.3 at R = 1.5 mm; FWHM shows three-stage evolution Friction tests: no significant resistance increase after 10,000 cycles under 50 g and 100 g loads Environmental stability: negligible change after 12 h in acid/alkali/salt and –100 °C exposure EMI shielding: SE_T > 60 dB (X-band), absorption-dominated (SE_A: 34–42 dB) IR reflectance: >85% across 1–3.8 μm Data Files: Raw_Data.xlsx – One Excel file containing all raw data, organized by sheets: Sheet Resistance, Bending Fatigue (1.5/2/3 mm), Friction Test (50 g/100 g), TGA, XPS Fitting, EMI Shielding Images.docx – A Word document containing all SEM and TEM images Video_S1.mp4 – Crumpling test demonstrating conductivity retention How Data Were Gathered: Sheet resistance: four-point probe (HPS2661A) Adhesion: cross-cut tape test (ASTM D3359 Method B) Morphology: SEM, TEM, AFM TGA: Netzsch TGA 209 F1 (air, 10 °C/min) XPS: Thermo Scientific K-Alpha (monochromatic Al Kα) Bending/friction tests: custom automated apparatus with in situ four-wire resistance monitoring (Keysight 34465A) EMI shielding: waveguide method (Agilent E5071C, X-band) IR reflectance: UV-Vis-NIR spectrophotometry (TP-720) Interpretation Notes: R/R₀ is normalized resistance; R/R₀ ≈ 1 indicates stability, increase indicates degradation FWHM three-stage evolution (decrease → rise → plateau) indicates micro-crack initiation, propagation, and saturation XPS: 161.38 eV = Au–S (covalent anchoring), 169.11 eV = SO₄²⁻ (dipole interactions) Strain calculation: ε = t/(2R), where t = 50 μm (PI thickness) All tests at ambient conditions unless specified License: Data are openly accessible. For questions, contact [e-mail].