OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT
收藏国家林业和草原科学数据中心2023-02-12 更新2024-03-07 收录
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资源简介：
An optoelectronic component 1 having a housing 2 is disclosed， which housing 2 has at least one recess 3A. This component also has at least one first semiconductor chip 4A， the first semiconductor chip 4A being arranged in the first recess 3A， and the first recess 3A being the first semiconductor chip 4A. It is designed as a reflector in order to reflect the radiation generated during the operation. This reflector has a surface， which surface is designed to deliberately adjust the emission characteristic 6 of the radiation emitted by the first semiconductor chip 4A during operation. Also disclosed is a method for manufacturing the optoelectronic component 1. Disclosed is an optoelectronic component (1) which has a housing (2)， the housing (2) having at least one recess (3A). The component also has at least one first semiconductor chip (4A)， the first semiconductor chip (4A) being arranged in the first recess (3A)， the first recess (3A) being designed as a reflector in order to reflect the radiation produced during operation of the first semiconductor chip (4A). The reflector has a surface， the surface being designed for deliberately adjusting an emission characteristic (6) of the radiation emitted by the first semiconductor chip (4A) during operation. Further disclosed is a method for producing an optoelectronic component (1). Disclosed is an optoelectronic component (1) which has a housing (2)， the housing (2) having at least one recess (3A). The component also has at least one first semiconductor chip (4A)， the first semiconductor chip (4A) being arranged in the first recess (3A)， the first recess (3A) being designed as a reflector in order to reflect the radiation produced during operation of the first semiconductor chip (4A). The reflector has a surface， the surface being designed for deliberately adjusting an emission characteristic (6) of the radiation emitted by the first semiconductor chip (4A) during operation. Further disclosed is a method for producing an optoelectronic component (1).
提供机构：
国家林业和草原科学数据中心
创建时间：
2023-02-12
