Data for "Characterizing Interconnects to 325 GHz" to be submitted to "Transactions on Microwave Theory and Techniques"

Included here are figures and other relevant data from the paper "Characterizing Interconnects to 325 GHz". Abstract: We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line calibration and subsequently de-embeds the interconnect with a multi-tiered calibration. We experimentally validated our method with distributed contactless interconnects in the form of broadside coupled coplanar waveguides as a test case. We find excellent agreement between experiment, full-wave simulations, and a distributed model of contactless interconnects. This work provides a rigorous method to accurately characterize interconnects when conventional approaches are not applicable.