Supporting information for 'Equipment-friendly encapsulation structure of SiO2/Cu for efficient infrared shield'
收藏Mendeley Data2026-04-09 收录
下载链接：
https://data.mendeley.com/datasets/g5ff7p9vmm
下载链接
链接失效反馈官方服务：
资源简介：
Supporting information for 'Equipment-friendly encapsulation structure of SiO2/Cu for efficient infrared shield'
提供机构：
xiaonan li
