Effect of holmium oxide nanoparticle on the mechanical properties of epoxy resin composites

The materials used were commercially available bisphenol Aepoxyresin of type E51 (Yehao Co.Ltd, WX, China), JD 365curing agent (MYChemicalCo.Ltd,China)withafixed  ratio to resin ranging from 1:3 to 1:4, holmium oxide (LS  Co.Ltd, TJ, China), and silane coupling agent (SCA) of type  KH550 (CSJ Co. Ltd, NJ, China) The preparation pro cess is shown in Figure 1.TheHo2O3/EP nanocomposites with  different contents of Ho2O3 (0,0.5,1,1.5wt.%)wereprepared  for comparison experiments. Firstly, a certain amount of ac etone was mixed with epoxy resin, and then a certain amount of  Ho2O3 particles were added and dispersed under the combined  effect of ultrasonication and mechanical stirring for 2-4 h, after  removing the excess acetone, the curing agent was added and  stirred mechanically for 0.5 h, and then the mixtures were  placed in a vacuum drying oven to remove air bubbles and  poured into the mold, and the total curing process was about 5 h  after two steps, and then the specimens were removed from the  mold and were cooled to room temperature.