A floor-heating panel， a floor structure， and the manufacturing method of a pipe member

SUBJECT of the Invention The floor structure which can aim at the further performance improvement， and the manufacturing method of a pipe member can be provided. PROBLEM to be solved The flow-path cross-sectional area of the pipe member 6 is 22.5 mm 2 or more. Thereby， since it becomes easy to flow through a thermal medium， the thermal radiation ratio to a heat sinking plane can be improved. Periphery stress is 1.2 Mpa or less. It can be set as the intensity|strength which can fully ensure safety|security as the pipe member 6 used for the floor-heating panel 100 by this. The thick ratios with respect to the outer diameter of the pipe member 6 are 19 % or more and 25 % or less. By making a thick ratio into 25 % or less， thickness of a pipe member can be made thin. Thus， the heat|fever of a thermal medium can be made easy to transmit to the exterior of the pipe member 6 by making the pipe member 6 thin. Therefore， the thermal radiation performance of the floor-heating panel 100 can be improved. Moreover， intensity|strength sufficient by making a thick ratio into 19 % or more is securable. SELECTED DRAWINGS FIG. 2 [MAT_IMAGE 000002]