Data for: Joining of Oxygen-Free High-Conductivity Cu to CuCrZr by Direct Diffusion Bonding without Using an Interlayer at Low Temperature
收藏Mendeley Data2020-03-31 更新2026-04-09 收录
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https://data.mendeley.com/datasets/7h2z76n385
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资源简介：
Some data on joining of OFHC to CuCrZr have been created. The data including shear strength, EDS results and C-scan results of Cu/CuCrZr joints (composite panels).
创建时间：
2020-03-31
