[Manuscript] Enhancing Thermal-Shock Reliability of a Sleeveless Power Inductor Assembly upon Reflow Soldering

Name: [Manuscript] Enhancing Thermal-Shock Reliability of a Sleeveless Power Inductor Assembly upon Reflow Soldering
Creator: Telkom University Dataverse
Published: 2022-04-01T12:18:09+08:00

DataCite Commons2022-04-01 更新2025-04-16 收录

功率半导体可靠性

回流焊接工艺

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https://dataverse.telkomuniversity.ac.id/citation?persistentId=doi:10.34820/FK2/8HZIVH 数据链接链接失效反馈

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资源简介：

This manuscipt has been presented at the 2019 1st International Conference on Engineering and Management in Industrial System

提供机构：

Telkom University Dataverse

创建时间：

2022-04-01

[Manuscript] Enhancing Thermal-Shock Reliability of a Sleeveless Power Inductor Assembly upon Reflow Soldering

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