金丝键合链路高频仿真数据

该仿真数据主要来源与电磁仿真软件High Frequency Structure Simulator(HFSS)。所仿真结构为微波电路中金丝键合结构，仿真频段为0.1-70GHz，从而验证所提出的优化结构的高频性能。通过仿真，确定了所提出金丝键合结构的高频传输性能，为课题光电混合集成技术提供了指导。观测数据为模型在0.1-70GHz的传输系数S21和反射系数S11。

This simulation dataset is primarily sourced from the High Frequency Structure Simulator (HFSS), an electromagnetic simulation software. The simulated structure is the gold wire bonding structure in microwave circuits, with the simulation conducted across the 0.1–70 GHz frequency band to verify the high-frequency performance of the proposed optimized structure. Through the simulation runs, the high-frequency transmission performance of the proposed gold wire bonding structure was characterized, offering valuable guidance for the optoelectronic hybrid integration technology involved in this research project. The observed dataset consists of the transmission coefficient S21 and reflection coefficient S11 of the model over the 0.1–70 GHz frequency range.

搜集汇总

背景与挑战

背景概述

该数据集包含金丝键合结构在0.1-70GHz频段的高频仿真数据，使用HFSS软件生成，观测传输系数S21和反射系数S11，用于验证优化结构的高频传输性能。数据源自国家重点研发计划项目，旨在为光电混合集成技术提供指导，数据量较小（416.83KB，3个文件），由北京邮电大学创建并共享。