Elastic-plastic Single-Step and Multi-Step Indentation via IIT and AFM on Hybrid Bonding Copper
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This publication contains the data presented in the associated proceeding paper ”Pushing the Envelope in Mechanical Characterization of Copper in Hybrid-Bonding Patterns for Advanced Packaging: from Instrumented Indentation to Multimodal Atomic Force Microscopy” submitted for publication in the proceedings of the 2026 IEEE 76th Electronic Components and Technology Conference. The datasets were obtained in single-step and multi-step indentations using instrumented indentation (IIT) and atomic force microscope (AFM) on hybrid-bonding copper at room temperature.
