2025_Stegmann_Enhancing_Silver_Sintering

Research and raw data to publication: Enhancing Silver Sintering - Effect of Copper Substrate Microstructure on Silver Adhesion and Bond Strength供发表使用的研究与原始数据集：强化银烧结（Silver Sintering）——铜基底微观结构（Copper Substrate Microstructure）对银粘附性（Silver Adhesion）与结合强度（Bond Strength）的影响