Investigation of tin whisker growth behavior in COTS components under thermal vacuum cycling
收藏科学数据银行2025-08-25 更新2026-04-23 收录
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资源简介：
Tin whisker growth in COTS components was studied under thermal vacuum and air cycling. Results show higher susceptibility in ceramic capacitors, stress-driven mechanisms as the main cause, and faster growth in vacuum due to thinner oxide films.
提供机构：
Yongxin; Renxin
创建时间：
2025-08-25
