Effects of typical defects on TSV reliability under thermomechanical loading
收藏DataCite Commons2026-04-28 更新2026-05-05 收录
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https://www.scidb.cn/detail?dataSetId=e3bc0fb08c08413cb31bafca73889e29
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资源简介：
Process instability during TSV through-hole electroplating, typical defect models, stress cloud maps and microscopic characterization data under thermal loads
提供机构：
Science Data Bank
创建时间：
2026-04-28
