In-situ study of creep in Sn-3Ag-0.5Cu solder
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The data released here is for the paper "In-situ study of creep in Sn-3Ag-0.5Cu solder". DOI: 10.1016/j.actamat.2020.06.013 Tianhong Gu<sup>1</sup>*, Vivian S. Tong<sup>1,2</sup>, Christopher M. Gourlay<sup>1</sup>, and T. Ben Britton<sup>1</sup> Department of Materials, Imperial College London, SW7 2AZ. UK Now at: National Physical Laboratory, Hampton Rd, Teddington TW11 0LW, UK *Corresponding author: t.gu15@imperial.ac.uk, +44 20 7594 2634 *.bcf = Bruker BCF data for full EBSD map to plot EBSD maps<br> *.csv = spreadsheet of graphical data for plots in Fig2 (creep curves), Fig10 and Fig11 (Schmid factors and slip systems)<br> *.tif = images used to to build up Figures (the figures are presented in the powerpoint) The data bundle was prepared by Tianhong Gu
