Data associated with "Characterizing the broadband RF permittivity of 3D-integrated layers in a glass wafer stack from 100 MHz to 30 GHz" for the 2024 International Microwave Symposium (IMS) in Washington, D.C.

We present a method for accurately determining the permittivity of dielectric materials in 3D integrated structures at broadband RF frequencies. With applications of microwave and millimeter-wave electronics on the rise, reliable methods for measuring the electrical properties of dielectrics used in integrated circuits are critical. We outline an on-wafer method for extracting the permittivity of a 3D multilayer glass structure from 100 MHz to 30 GHz using S-parameter measurements of different calibration chips. Our method can be used to inform better design of metrology for dielectric materials for 3D integrated circuit technologies.