Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author's Work
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https://curate.curtin.edu.au/articles/conference_contribution/Themo-mechanical_Interfacial_Stress_Analysis_in_Electronic_Packaging_at_Different_Temperature_Conditions_Revisit_Author_s_Work/31687810
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资源简介：
Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author's Work
创建时间：
2026-03-27
