Gold nanocubic structures agglomeration when put on conductive surfaces

This dataset contains SEM images of gold nanocubes (AuNC), which were deposited at the conductive Si wafer surface and dried. The deposition method, the solvent used and AuNC concentration have a significant influence on the homogeneous distribution and their agglomeration at the surface, further influencing the electrochemical characteristics of the electrodes operating with their use.  
The surfactant used was CTAB. The images are characterized with different surfactant concentration in the solvent: sample 1,2 - 1mM CTAB, 3 - 0.1 mM CTAB, 4 - 0.01 mM CTAB. The amount of used AuNC was 10 uL in each case. The volume of the solvent deposited at the surface was 5 mL. Label (A) means that sample was additionally washed with deionized water.

The topography analysis was investigated by scanning electron microscopy (FEI Quanta FEG 250) with an Everhart–Thornley secondary electron detector at an acceleration voltage of 20 kV.