Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth
收藏DataCite Commons2024-09-10 更新2024-11-06 收录
下载链接：
https://rs.figshare.com/articles/dataset/Supplementary_Material_from_Low_temperature_Cu-Cu_direct_bonding_in_air_ambient_by_ultrafast_surface_grain_growth/26956246/1
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资源简介：
electronic supplementary material (ESM)-dataset.xlsx
提供机构：
The Royal Society
创建时间：
2024-09-06
