Bead-Resolved Prediction of Warpage, Residual Stress, and Predicted Failure-Critical Locations in Metal-Filled PLA Additive Manufacturing

Description This dataset supports the study on bead-resolved digital twin modeling for predicting warpage in metal fused filament fabrication (FFF). It contains geometry, simulation inputs, and post-processed results used to quantify thermo-mechanical deformation driven by bead-scale morphology and deposition sequencing. The dataset includes: Reconstructed geometries Bead-resolved voxelized and/or mesh representations derived from G-code toolpaths Super-elliptic bead parameterization capturing filament cross-sectional shape Simulation inputs Process parameters (layer height, bead width, deposition order) Material properties for metal–polymer systems (e.g., IN718–PLA, Cu–PLA) Thermal boundary conditions and activation sequences Mechanical / warpage results Predicted displacement fields Distortion metrics and global warpage indicators Eigenstrain-based deformation fields (if applicable) Validation data 3D scan-derived geometries of printed specimens Registered deviation maps between simulation and experiment Methodology Summary The digital twin reconstructs deposited filaments directly from toolpath data using a bead-resolved representation. A voxel-based transient thermal simulation is performed with activation synchronized to deposition order. Resulting thermal histories are mapped to a mechanical model to predict residual stress-induced deformation and warpage.