X-ray Computed Tomography Experiments and Simulations of an Advanced Integrated Circuit Package

X-ray computed tomography (XCT) is a nondestructive method that uses multiple X-ray projections to create detailed 3D internal models of materials without damaging them. In the semiconductor industry, XCT is used for failure analysis, quality control, and process improvement. Integrated circuit (IC) packages can be inspected with XCT to detect failures and counterfeit components. However, there are limited data sets publicly available containing XCT measurements of advanced packages.