Research on environmental simulation methodologies for aerospace hybrid circuits based on flexible chips

In response to the environmental adaptability analysis challenges which arise due to flexible electronic technologies applied to aerospace， a study is conducted on simulation methods for space environment adaptability of hybrid integrated circuits based on flexible chips. Firstly， combined with the characteristics of flexible hybrid circuits， weak objects in the environments of bending stress， thermology and mechanics are targeted. A multi-dimensional selection of flexible chips， packaged devices and flexible circuit boards is made for modeling and simulation method research. Subsequently， this method is applied to simulation analysis on a kind of flexible hybrid circuit， and the simulation results are used to guide the design and optimization of the circuit. The research results indicate that this method has guiding significance for initially assessing the performance of flexible integrated circuits in complex space environments， which lays a foundation for promoting the application of flexible electronic technology in aerospace industry.