Non-Destructive Thickness Mapping Of Wafer-Scale Hexagonal Boron Nitride Down To A Monolayer

Name: Non-Destructive Thickness Mapping Of Wafer-Scale Hexagonal Boron Nitride Down To A Monolayer
Creator: University of Cambridge; Technical University of Denmark
Published: 2018-07-16T00:00:00+08:00

Zenodo2018-07-16 更新2026-04-07 收录

材料表征

半导体材料

数据链接：

https://zenodo.org/record/1312844 数据链接链接失效反馈

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资源简介：

Raw data associated with the publication "Non-Destructive Thickness Mapping of Wafer-Scale Hexagonal Boron Nitride<br> Down to a Monolayer" published in ACS Applied Materials & Interfaces under the DOI: 10.1021/acsami.8b08609

提供机构：

University of Cambridge; Technical University of Denmark

创建时间：

2018-07-16