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Data on Thermal Conductivity of Thermal Insulation Boards

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Figshare2023-02-09 更新2026-04-28 收录
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The CSV file contains the data on the relationship between thermal conductivity of the fibrous fumed silica compacts and temperature in Fig. 5 of the manuscript. The specimens are (1) hydrophilic silica added, (2) hydrophobic silica added, and (3) after 400 ℃ heat treatment of the board (2). Thermal conductivity (λ) is calculated using the following equation. λ = αcρ (α: thermal diffusivity, c: specific heat, ρ: density) Instrument Measurement system by cyclic heating method (Thermal diffusivity) ; Drop calorimeter (Specific heat) Measurement condition Temperature: 100, 200, 300, 400, 600 ℃ Atmosphere: 1 atm, in air Experimental condition Compounding ratio : Fumed silica nanoparticle 60 mass%; SiC particle 20 mass%; Glass fiber 20 mass%. Pressure of uniaxial press: 2 Mpa
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2023-02-09
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